Over Molding, Insert Molding & Encapsulation Molding

Theme Park "Smart Band"Theme Park "Smart Band"

Laser Sight Hand Gun Stock w/ Over Molded ButtonLaser Sight Hand Gun Stock w/ Over Molded Button

Impact Sensing Sports Mouth GuardMulti-Shot Impact Sensing Sports Mouthguard

Over Molded Water Intake Filter ScreenOver Molded Water Intake Filter Screen

Multi-Function Folding Scissors in HolsterOver-Molded Multi-Function Folding Scissors

 

Insert molding and over-molding are core competencies at PILLER AIMMCO.  We can point to hundreds of successful projects with parts incorporating multiple shots over a variety of substrates including metal, plastic, fabrics, and more recently, electronics.  With the increasing miniaturization of micro-electronics and the expanding desire for interconnectivity, more and more products are being developed that involve the insert molding or over-molding of electronics, and PILLER AIMMCO has been at the forefront of this development, collaborating with product design companies, engineering firms, start-ups and fortune 100 OEM’s to develop strategies enabling the over-molding of populated PCB’s, flexible circuits and electro-mechanical assemblies.

Contact us to discuss your over-molding and insert molding requirements, we welcome the opportunity to bring our expertise to your next project.

The Process

Over-Molding, Insert Molding and Encapsulation Molding are terms used to denote the process of molding plastic around or over a variety of substrates such as metals, plastics, assemblies and electronics. The process can be done as a single shot of plastic onto the substrate, or as a multiple shot process using a variety of thermoplastic materials. Over-molding, insert molding and encapsulation molding are quite common for products and components in all industries, making possible the incorporation of desirable features such as:

  • Tactile soft-touch finishes
  • Multiple Colors and Effects
  • Protection from dust and liquids
  • Vibration and Shock Protection
  • Elimination of secondary assembly processes
  • Reduced part counts

The challenge in developing over-molded components are primarily geometry and tooling related. The substrate being over-molded must be consistent in size, with particular attention paid to the areas being sealed during the over-mold shot. Typical tolerance requirements for these features are within 0.001" with exceptions for softer substrates that can tolerate some amount of "crush". The substrate geometry must also be carefully considered in order to establish how best to seal its’ surface against the pressure of the over-mold shot, supporting areas that cannot be backed by tool steel, and providing a means for optimized gate locations.

Because of the many nuances involved, an iterative tooling approach is commonly required to achieve the best results, and with our vertically integrated manufacturing operations, we excel at these activities. With mold modifications performed in-house, driven by our engineering team and carried-out in a matter of hours or days, not weeks, we routinely take-on challenging projects involving feature sets that others have declined to entertain. We approach these projects with a collaborative mind set and can proudly point to a history of success in pushing the envelope of what is possible with the injection molding process.

PILLER AIMMCO – We Plan, We Execute, We Deliver